Micro-wire pattern for electrode connection

ABSTRACT

Micro-wires are arranged to form an electrical conductor connected to an electrode structure. The electrical conductor includes a plurality of spaced-apart first micro-wires extending in a first direction, wherein one of the first micro-wires is a connection micro-wire. A plurality of spaced-apart second micro-wires extends in a second direction different from the first direction. At least two adjacent second micro-wires are spaced apart by a distance greater than the spacing between at least two adjacent first micro-wires. Each second micro-wire is electrically connected to at least two first micro-wires. The electrode structure includes a plurality of electrically connected third micro-wires electrically connected to the connection micro-wire at spaced-apart connection locations and at least some of the adjacent connection locations are separated by a distance greater than any of the distances separating the second micro-wires.

CROSS REFERENCE TO RELATED APPLICATIONS

Reference is made to commonly assigned, co-pending U.S. patentapplication Ser. No. (Docket K001319) filed concurrently herewith,entitled “Large-Current Micro-Wire Pattern” by Lebens et al; U.S. patentapplication Ser. No. (Docket K001332) filed concurrently herewith,entitled “Micro-Wire Electrode Buss” by Lebens et al; and U.S. patentapplication Ser. No. (Docket K001333) filed concurrently herewith,entitled “Conductive Micro-Wire Structure” by Lebens et al, thedisclosures of which are incorporated herein.

Reference is made to commonly-assigned U.S. patent application Ser. No.13/571,704 filed Aug. 10, 2012, entitled “Micro-Wire Electrode Pattern”by Ronald S. Cok;

FIELD OF THE INVENTION

The present invention relates to micro-wire electrical conductors.

BACKGROUND OF THE INVENTION

Transparent conductors are widely used in the flat-panel displayindustry to form electrodes for electrically switching thelight-emitting or light-transmitting properties of a display pixel, forexample in liquid crystal or organic light-emitting diode displays.Transparent conductive electrodes are also used in touch screens inconjunction with displays. In such applications, the transparency andconductivity of the transparent electrodes are important attributes. Ingeneral, it is desired that transparent conductors have a hightransparency (for example, greater than 90% in the visible spectrum) anda low electrical resistivity (for example, less than 10 ohms/square).

Touch screens with transparent electrodes are widely used withelectronic displays, especially for mobile electronic devices. Suchdevices typically include a touch screen mounted over an electronicdisplay that displays interactive information. Touch screens mountedover a display device are largely transparent so a user can viewdisplayed information through the touch-screen and readily locate apoint on the touch-screen to touch and thereby indicate the informationrelevant to the touch. By physically touching, or nearly touching, thetouch screen in a location associated with particular information, auser can indicate an interest, selection, or desired manipulation of theassociated particular information. The touch screen detects the touchand then electronically interacts with a processor to indicate the touchand touch location. The processor can then associate the touch and touchlocation with displayed information to execute a programmed taskassociated with the information. For example, graphic elements in acomputer-driven graphic user interface are selected or manipulated witha touch screen mounted on a display that displays the graphic userinterface.

Referring to FIG. 10, a prior-art display and touch-screen system 100includes a display 110 having a display area 111. A corresponding touchscreen 120 is mounted with display 110 so that information displayed ondisplay 110 in display area 111 can be viewed through touch screen 120.Graphic elements displayed on the display 110 in display area 111 areselected, indicated, or manipulated by touching a corresponding locationon touch screen 120. Touch screen 120 includes a first transparentsubstrate 122 with first transparent electrodes 130 formed in the xdimension on first transparent substrate 122 and a second transparentsubstrate 126 with second transparent electrodes 132 formed in the ydimension facing the x-dimension first transparent electrodes 130 onsecond transparent substrate 126. A dielectric layer 124 is locatedbetween first and second transparent substrates 122, 126 and first andsecond transparent electrodes 130, 132. Referring also to the prior-artplan view of FIG. 11, in this example first pad areas 128 in firsttransparent electrodes 130 are located adjacent to second pad areas 129in second transparent electrodes 132 in display area 111. (First andsecond pad areas 128, 129 are separated into different parallel planesby dielectric layer 124.) First and second transparent electrodes 130,132 have a variable width and extend in orthogonal directions (forexample as shown in U.S. Patent Application Publication Nos.2011/0289771 and 2011/0099805). When a voltage is applied across firstand second transparent electrodes 130, 132, electric fields are formedbetween first pad areas 128 of x-dimension first transparent electrodes130 and second pad areas 129 of y-dimension second transparentelectrodes 132.

A display controller 142 (FIG. 10) connected through electrical busses136 controls display 110 in cooperation with a touch-screen controller140. Touch-screen controller 140 is connected through electrical busses136 and wires 134 outside display area 111 and controls touch screen120. Touch-screen controller 140 detects touches on touch screen 120 bysequentially electrically energizing and testing x-dimension first andy-dimension second transparent electrodes 130, 132.

Referring to FIG. 12, in another prior-art embodiment, rectangular firstand second transparent electrodes 130, 132 are arranged orthogonally indisplay area 111 projected from display 110 onto first and secondtransparent substrates 122, 126 with intervening transparent dielectriclayer 124, forming touch screen 120 which, in combination with display110 forms touch screen and display system 100. First and second padareas 128, 129 are formed where first and second transparent electrodes130, 132 overlap. Touch screen 120 and display 110 are controlled bytouch screen and display controllers 140, 142, respectively, throughelectrical busses 136 and wires 134 outside display area 111.

The electrical busses 136 and wires 134 are electrically connected tofirst or second transparent electrodes 130, 132 but are located outsidedisplay area 111. However, at least a portion of electrical busses 136or wires 134 are formed on touch screen 120 to provide the electricalconnection to first or second transparent electrode 130, 132. It isdesirable to increase the size of display area 111 with respect to theentire display 110 and touch screen 120. Thus, it can be helpful toreduce the size of wires 134 and busses 136 in touch screen 120 outsidedisplay area 111. At the same time, to provide excellent electricalperformance, wires 134 and busses 136 need a low resistance.Furthermore, to reduce manufacturing costs, it is desirable to reducethe number of manufacturing steps and materials in touch screen 120.

Touch-screens including very fine patterns of conductive elements, suchas metal wires or conductive traces, are known. For example, U.S. PatentApplication Publication No. 2010/0026664 teaches a capacitive touchscreen with a mesh electrode, as does U.S. Pat. No. 8,179,381. Referringto FIG. 13, a prior-art x- or y-dimension variable-width first or secondtransparent electrode 130, 132 includes a micro-pattern 156 ofmicro-wires 150 arranged in a rectangular grid. The micro-wires 150 aremultiple very thin metal conductive traces or wires formed on the firstand second transparent substrates 122, 126 (not shown in FIG. 13) toform the x- or y-dimension first or second transparent electrodes 130,132. The micro-wires 150 are so narrow that they are not readily visibleto a human observer, for example 1 to 10 microns wide. The micro-wires150 are typically opaque and spaced apart, for example by 50 to 500microns, so that the first or second transparent electrodes 130, 132appear to be transparent and the micro-wires 150 are not distinguishedby an observer.

U.S. Patent Application Publication No. 2011/0291966 discloses an arrayof diamond-shaped micro-wire structures. In this disclosure, a firstelectrode includes a plurality of first conductor lines inclined at apredetermined angle in clockwise and counterclockwise directions withrespect to a first direction and provided at a predetermined interval toform a grid-shaped pattern. A second electrode includes a plurality ofsecond conductor lines, inclined at the predetermined angle in clockwiseand counterclockwise directions with respect to a second direction, thesecond direction perpendicular to the first direction and provided atthe predetermined interval to form a grid-shaped pattern. Thisarrangement is used to inhibit Moiré patterns. The electrodes are usedin a touch screen device. Referring to FIG. 14, this prior-art designincludes micro-wires 150 arranged in a micro-pattern 156 with themicro-wires 150 oriented at an angle to the direction of horizontalfirst transparent electrodes 130 in a first layer (e.g. firsttransparent substrate 122 in FIG. 12) and vertical second transparentelectrodes 132 in a second layer (e.g. second transparent substrate 126in FIG. 12).

A variety of layout patterns are known for micro-wires used intransparent electrodes. U.S. Patent Application Publication No.2012/0031746 discloses a number of micro-wire electrode patterns,including regular and irregular arrangements. The conductive pattern ofmicro-wires in a touch screen can be formed by closed figuresdistributed continuously in an area of 30% or more, preferably 70% ormore, and more preferably 90% or more of an overall area of thesubstrate and can have a shape where a ratio of standard deviation foran average value of areas of the closed figures (a ratio of areadistribution) can be 2% or more. As a result, a Moiré phenomenon can beprevented and excellent electric conductivity and optical properties canbe satisfied. U.S. Patent Application Publication No. 2012/0162116discloses a variety of micro-wire patterns configured to reduce or limitinterference patterns. As illustrated in prior-art FIG. 15, U.S. PatentApplication Publication No. 2011/0007011 teaches a first or secondtransparent micro-wire electrode 130, 132 having micro-wires 150arranged in a micro-wire pattern 156.

However, as noted above, it is useful to form electrical busses 136 andwires 134 with a reduced size compared to transparent micro-wireelectrodes outside display area 111 in touch screen 120. To provideexcellent electrical performance, wires 134 and electrical busses 136need a low resistance. It is also desirable to reduce the number ofmanufacturing steps and materials in touch screen 120. There is a need,therefore, for an improved electrically conductive structure that iscompatible with transparent electrodes, provides improved conductivity,and is robust in the presence of faults.

SUMMARY OF THE INVENTION

In accordance with the present invention, micro-wires arranged to forman electrical conductor connected to an electrode structure comprise:

the electrical conductor having a plurality of spaced-apart firstmicro-wires extending in a first direction, wherein one of the firstmicro-wires is a connection micro-wire, and a plurality of spaced-apartsecond micro-wires extending in a second direction different from thefirst direction, at least two adjacent second micro-wires spaced apartby a distance greater than the spacing between at least two adjacentfirst micro-wires and each second micro-wire being electricallyconnected to at least two first micro-wires; and

the electrode structure having a plurality of electrically connectedthird micro-wires electrically connected to the connection micro-wire atspaced-apart connection locations and at least some of the adjacentconnection locations are separated by a distance greater than any of thedistances separating the second micro-wires.

The present invention provides a conductive micro-wire structure capableof conducting relatively large electrical currents in a relatively smallarea compared to transparent micro-wire electrodes and is robust in thepresence of faults in the micro-wires. The conductive micro-wirestructure can be constructed in a common manufacturing step and in or ona common substrate with transparent micro-wire electrodes providing asimplified micro-wire structure and electrical circuit for devicescontrolling transparent micro-wire electrodes.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present inventionwill become more apparent when taken in conjunction with the followingdescription and drawings wherein identical reference numerals have beenused to designate identical features that are common to the figures, andwherein:

FIGS. 1-7 are plan views of various conductive micro-wire structurepatterns illustrating corresponding embodiments of the presentinvention;

FIG. 8 is a plan view of a conductive micro-wire structure patternelectrically connected to a transparent micro-wire electrodeillustrating an embodiment of the present invention;

FIGS. 9A-9B are plan views of conductive micro-wire structure patternselectrically connected to a transparent micro-wire electrodeillustrating other embodiments of the present invention;

FIG. 10 is an exploded perspective illustrating a prior-art mutualcapacitive touch screen having adjacent pad areas in conjunction with adisplay and controllers;

FIG. 11 is a schematic illustrating prior-art pad areas in a capacitivetouch screen;

FIG. 12 is an exploded perspective illustrating a prior-art mutualcapacitive touch screen having overlapping pad areas in conjunction witha display and controllers;

FIG. 13 is a schematic illustrating prior-art micro-wires in anapparently transparent electrode.

FIG. 14 is a schematic illustrating prior-art transparent micro-wireelectrodes arranged in two arrays of orthogonal transparent electrodes;

FIG. 15 is a schematic illustrating a prior-art transparent micro-wireelectrode;

FIG. 16 is a cross section illustrating a rectangular micro-channeluseful in the present invention;

FIG. 17 is a cross section illustrating a micro-wire located in themicro-channel of FIG. 16 useful in the present invention;

FIG. 18 is a cross section illustrating a trapezoidal micro-channeluseful in the present invention;

FIG. 19 is a cross section illustrating a micro-wire located in themicro-channel of FIG. 18 useful in the present invention;

FIG. 20 is a cross section illustrating a micro-wire located on thesurface of a substrate useful in the present invention;

FIG. 21A is a representation of a perspective micrograph ofmicro-channels useful in the present invention; and

FIG. 21B is a representation of a top-view micrograph of an embodimentof the present invention;

FIGS. 22-25 are flow charts illustrating various methods of making thepresent invention;

FIG. 26 is a schematic illustrating an embodiment of the presentinvention in an electronic system;

FIG. 27A is a cross section of a micro-channel useful in the presentinvention; and

FIG. 27B is a cross section of a micro-channel useful in the presentinvention.

The Figures are not necessarily to scale, since the range of dimensionsin the drawings is too great to permit depiction to scale.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is directed toward electrically conductivemicro-wire structures formed on or in a substrate that are capable ofconducting relatively large electrical currents in relatively smallareas with reduced electrical resistance compared to transparentmicro-wire electrodes. The electrically conductive micro-wire structuresare robust in the presence of faults in the micro-wires and can beconstructed in a common manufacturing step in or on a common substratewith transparent micro-wire electrodes. As used herein, the substratesare not integrated circuit substrates and are of a size with which ahuman user can directly interact. Such micro-wire structures can providesimplified electrically conductive elements and electrical circuits forcontrolling or interconnecting with transparent micro-wire electrodes.The electrically conductive micro-wire structures of the presentinvention can also be useful in other applications and are not limitedto applications having transparent micro-wire electrodes.

In particular, transparent micro-wire electrodes known in the prior artincluding spaced-apart micro-wires located on either side of adielectric layer are known for making capacitive touch screens (e.g. asillustrated in FIGS. 10-15 and discussed above). Such transparentmicro-wire electrodes typically have a transparency of 85%, or morepreferably greater than 90%. An objective of such prior-art transparentmicro-wire electrodes is to provide both transparency and conductivityover the extent of a substrate, for example over the display area of acapacitive touch screen (e.g. display area 111 and touch screen 120 ofFIG. 12).

In operation, such prior-art transparent micro-wire electrodes areelectrically connected to a controller. The electrical connections aretypically made using solid-wire electrical conductors (often calledtraces) formed on the same substrate as the transparent micro-wireelectrodes. Such solid-wire electrical conductors are commonly found inprinted circuit boards or on flexible substrates in electronic devices.Solid-wire electrical conductors are typically greater than 100 micronswide, are often greater than one mm wide, and can be made bypattern-wise etching a layer of conductive material formed on thesubstrate. Separate solid-wire electrical conductors can be used inmulti-wire busses or as single wires that electrically connect to acontroller such as an integrated circuit processor that operates thetransparent micro-wire electrodes. In some prior-art devices, theintegrated circuit processor is adhered to the same substrate; in othersa connector from the substrate to the integrated circuit processor isneeded.

In any case, the prior-art solid-wire conductors are made usingconventional processes such as those used in printed circuit boards orflat-panel display substrates that can be different from the processesused to make transparent micro-wire electrodes. Thus, additionalprocessing steps and processing conditions are useful to electricallyconnect prior-art transparent micro-wire electrodes on a substrate to aconnector or controller. Such additional processing steps and conditionsincrease costs and reduce the range of usable materials.

According to embodiments of the present invention, electricallyconductive micro-wire structures provide greater conductivity in smallerareas than are achieved with conventional transparent micro-wireelectrodes. Such electrically conductive micro-wire structures have atransparency that is less than the transparency of transparentmicro-wire electrodes. In contrast to disclosures of the prior art, theconductive micro-wire structures of the present invention are notnecessarily visually transparent. Thus, the prior art, by emphasizingthe transparency of micro-wire electrodes, teaches away from the presentinvention. For example, U.S. Pat. No. 8,179,381 discloses a transparentmicro-wire electrode with micro-wires between 0.5μ and 4μ wide and atransparency of between approximately 86% and 96%.

The electrically conductive micro-wire structures of the presentinvention can be made using the same processes and in the same steps asare used to construct conventional transparent micro-wire electrodes.The present invention, therefore, reduces manufacturing costs and doesnot further reduce the range of materials that can be used in asubstrate having micro-wire electrical conductors formed thereon.

It has been discovered through experimentation, that useful methods ofmaking micro-wires in a substrate can be limited in the number, size,and spacing of the micro-wires made. Thus, there is a limit to theamount of material, for example metal, that forms micro-wires in a givenarea on a substrate. This, in turn, limits the number, size, and spacingof micro-wires in or on the substrate. For example, it has beendemonstrated that micro-wires can be made in a substrate surfaceembossed with micro-channels by coating the substrate with a conductiveink or immersing the substrate in a bath of conductive ink and thenremoving excess material not in the micro-channels. However, it has alsobeen demonstrated that if the micro-channels are too large, are tooclose together, or are too interconnected, any resulting micro-wires arenot clearly defined and their shape is not controlled well. Similarly,in another example, a print master (for example a flexographic printingplate) having a relief pattern is coated with a conductive ink and thepattern transferred to a substrate. If the pattern includes relativelylarge areas, areas that are too close together, or areas that are toointerconnected, the resulting pattern is not clearly defined and theshape of any printed micro-wires is not controlled well.

Poorly defined electrically conductive patterns on a substrate can leadto unwanted electrical conduction, such as electrical shorts. Thus,there can be a limit, not recognized in the prior art, to the densityand size with which micro-wires can be formed in a substrate using someuseful methods for making micro-wires in a substrate. Such usefulmethods can have reduced costs or improved manufacturing efficiencies orperformance, and there is therefore a need for electrically conductivemicro-wire structures and patterns that avoid such manufacturingconstraints. Not only are the size and density limits for micro-wires,made according to some manufacturing methods, not recognized in theprior art, the desirability of forming such highly conductive, lesstransparent electrically conductive micro-wire structures is notrecognized or is not appreciated.

In various embodiments, the electrically conductive micro-wirestructures of the present invention are used to make electricalconductors and busses for electrically connecting transparent micro-wireelectrodes to electrical connectors or controllers such as integratedcircuit controllers. One or more electrically conductive micro-wirestructures are used in a single substrate and are used, for example intouch screens that use transparent micro-wire electrodes. Theelectrically conductive micro-wire structures are located in areas otherthan display areas, for example in the perimeter of the display area ofa touch screen, where the display area is the area through which a userviews a display.

Referring to FIG. 1 in an embodiment of the present invention, aconductive micro-wire structure 5 includes a substrate 40. A pluralityof micro-wires 50 forming an electrical conductor is formed in or onsubstrate 40. A micro-wire pattern 55 of micro-wires 50 includesspaced-apart first micro-wires 10 formed on or in substrate 40 thatextend across substrate 40 in a first direction D1. A plurality ofspaced-apart second micro-wires 20 are formed on or in substrate 40 andextend across substrate 40 in a second direction D2 different from firstdirection D1. Each second micro-wire 20 is electrically connected to atleast two first micro-wires 10 and at least one of second micro-wires 20has a width W2 less than a width W1 of at least one of the firstmicro-wires 10. As shown in the embodiment of FIG. 1, second micro-wires20 are spaced apart by a distance L2 that is greater than a distance L1separating first micro-wires 10.

Substrate 40 can be a rigid or a flexible substrate made of, forexample, a glass or polymer material, can be transparent, and can haveopposing substantially parallel and extensive surfaces. Substrates 40can include a dielectric material useful for capacitive touch screensand can have a wide variety of thicknesses, for example 10 microns, 50microns, 100 microns, 1 mm, or more. In various embodiments of thepresent invention, substrates 40 are provided as a separate structure orare coated on another underlying substrate, for example by coating apolymer substrate layer on an underlying glass substrate. Suchsubstrates 40 and their methods of construction are known in the priorart. Substrate 40 can be an element of other devices, for example thecover or substrate of a display or a substrate or dielectric layer of atouch screen.

Referring briefly to FIG. 17 (discussed further below), a width W6 of amicro-wire 50 is the linear extent of a cross section of micro-wire 50in a direction parallel to the extensive surface 41 of substrate 40 onor in which micro-wire 50 is located. A thickness 62 of a micro-wire 50is the linear extent of a cross section of the micro-wire 50 in adirection perpendicular to surface 41 of substrate 40 on or in whichmicro-wire 50 is located. Thickness 62 is also the depth micro-wire 50extends from surface 41 of substrate 40. The length of micro-wire 50 isthe linear extent of micro-wire 50 over or in and parallel to surface 41of substrate 40 on or in which micro-wire 50 is located. The length ofmicro-wire 50 is greater than the width or thickness of micro-wire 50.The length, width, and thickness (depth) of micro-wire 50 are typicallysubstantially orthogonal dimensions. For example, referring back to theexample of FIG. 1, the length of micro-wires 50 extends in either firstor second direction D1 or D2. Distance L1 is the length of secondmicro-wires 20.

According to embodiments of the present invention, micro-wires 50 (e.g.first and second micro-wires 10, 20) extend across substrate 40. By“extend across” is meant that micro-wires 50 are longer than they arewide and the length of micro-wires 50 is in a direction parallel to asurface of substrate 40. The length of first or second micro-wires 10,20 is typically less than the size of a surface of substrate 40 in anyplanar dimension. In particular, “extend across” does not mean that anymicro-wire 50 has a length equal to the size of any planar surfacedimension of substrate 40 or extends across substrate 40 from one edgeof substrate 40 to another.

Referring to FIG. 8, in an alternative embodiment of the presentinvention, micro-wires 50 are arranged in a micro-wire pattern 55 toform an electrical conductor connected to an electrode structure. Theelectrical conductor includes a plurality of spaced-apart firstmicro-wires 10 extending in a first direction D1. One of firstmicro-wires 10 is a connection micro-wire 14. A plurality ofspaced-apart second micro-wires 20 extends in a second direction D2different from first direction D1. At least two adjacent secondmicro-wires (21, 22) are spaced apart by a distance L2 greater thandistance L1 spacing apart at least two adjacent first micro-wires 11, 12and each second micro-wire 20 is electrically connected to at least twofirst micro-wires 10. The electrode structure includes a plurality ofelectrically connected third micro-wires 30 electrically connected toconnection micro-wire 14 at spaced-apart connection locations 34. Atleast some of the adjacent connection locations 34 are separated by adistance L3 greater than any of distances L2 separating secondmicro-wires 20. Third micro-wires 30 can form a transparent micro-wirestructure, for example an apparently transparent electrode.

First, second, and third micro-wires 10, 20, and 30, can be formed in acommon process step and with common materials. Alternatively, differentprocess steps and different materials can be used.

First, second, and third micro-wires 10, 20, and 30 can be identical.Third micro-wires 30 can form a transparent electrode and first andsecond micro-wires 10, 20 can form electrically conductive micro-wirestructure 5 with a higher electrical conductivity, since first andsecond micro-wires 10, 20 are located more densely over substrate 40. Inan embodiment, because the pattern of micro-wires 50 formed by theplurality of first and second micro-wires 10, 20 has a transparency thatis typically less than the transparency of the pattern of micro-wires 50formed by the plurality of third micro-wires 30, the pattern ofmicro-wires 50 formed by the plurality of first and second micro-wires10, 20 has an electrical resistance that is less than the micro-wirepattern 55 of micro-wires 50 formed by the plurality of thirdmicro-wires 30.

Referring again to FIG. 1, in yet another embodiment of the presentinvention, an electrically conductive micro-wire structure 5 includes asubstrate 40 and a plurality of spaced-apart electrically connectedmicro-wires 50 formed on or in substrate 40. Electrically conductivemicro-wire structure 5 has a transparency of less than 75% and greaterthan 0%. The transparency of electrically conductive micro-wirestructure 5 is the percent of the substrate area over which micro-wires50 extend that is not covered by micro-wires 50. As illustrated in FIG.1, the total area over which micro-wires 50 extend is the product of thelengths of directional arrows D1 and D2. In this example, the percent ofthe total area covered by the micro-wires 50 is about 38%. Thus, thetransparency of conductive micro-wire structure 5 of FIG. 1 is about62%. The transparency of the conductive micro-wire structure 5 can becontrolled by changing distance L1 between first micro-wires 10, widthW1 of first micro-wires 10, distance L2 between second micro-wires 20,and width W2 of second micro-wires 20 relative to each other.

Electrically conductive micro-wire structure 5 of the present inventioncan have a direction of greater or preferred conductance. For example,as shown in FIG. 1, because first micro-wires 10 are wider and moreclosely spaced apart than second micro-wires 20, the conductance perunit length of electrically conductive micro-wire structure 5 will begreater in first direction D1 than in second direction D2.

The present invention includes a wide variety of micro-wire patternvariations. These variations can apply to both of the micro-wirepatterns 55 illustrated in FIGS. 1 and 8. For example, in embodimentsillustrated in FIGS. 1 and 8, electrically conductive micro-wirestructure 5 includes at least one second micro-wire 20 with a width W2less than any of widths W1 of first micro-wires 10. Alternatively, eachsecond micro-wire 20 has a width W2 less than any of widths W1 of firstmicro-wires 10. First micro-wires 10 can have a common first width W1.Alternatively, or in addition, second micro-wires 20 can have a commonsecond width W2.

Similarly, in the embodiments of FIGS. 1 and 8, electrically conductivemicro-wire structure 5 includes at least two adjacent second micro-wires21, 22 that are spaced apart by a distance L2 greater than distance L1between any two adjacent first micro-wires 11, 12. Alternatively,micro-wire pattern 55 can include adjacent first micro-wires 11, 12 thatare substantially equally spaced apart or adjacent second micro-wires21, 22, 23 that are substantially equally spaced apart.

Referring to FIG. 2, in other embodiments of the present invention,connection micro-wire 14 has a width W3 that is wider than width W1 ofat least one other first micro-wire 10, 11, 12. Alternatively, at leastone of first micro-wires 12 that is closer to connection micro-wire 14has a width W4 that is wider than width W1 of at least one other firstmicro-wire 11 that is farther from connection micro-wire 14 than firstmicro-wire 12. Furthermore, in another embodiment illustrated in FIG. 2,at least one of second micro-wires 24 closer to connection micro-wire 14has a width W5 that is wider than a width W6 of another secondmicro-wire 23 that is farther from connection micro-wire 14 than secondmicro-wire 24. Furthermore, since second micro-wire 20 is farther fromconnection micro-wire 14 than second micro-wire 23, second micro-wire 23has a width W6 that is wider than width W2 of second micro-wire 20.

Referring to FIG. 3, in another embodiment of the present invention, atleast two adjacent first micro-wires 11, 12 closer to connectionmicro-wire 14 are more closely spaced apart than at least two adjacentfirst micro-wires 10 that are farther from connection micro-wire 14. Asshown in FIG. 3, connection micro-wire 14 is spaced apart from firstmicro-wire 12 by a distance L5 that is smaller than a distance L4separating first micro-wire 11 from first micro-wire 12. Furthermore,distance L4 separating first micro-wire 11 from first micro-wire 12 issmaller than distance L1 separating first micro-wires 10 or firstmicro-wire 10 and first micro-wire 11. First micro-wires 10 are farthestfrom connection micro-wire 14, followed by first micro-wire 11 and thenfirst micro-wire 12.

Referring to the embodiment illustrated in FIG. 4, connection micro-wire14 has first micro-wires 11, 12 on either side, rather than on only oneside, as in FIG. 3. In this embodiment, connection micro-wire 14 has awidth W3. First micro-wires 11, 12 closest to connection micro-wire 14have a width W4 that is less than width W3 but is greater than width W1of first micro-wires 10 that are farther from connection micro-wire 14than are first micro-wires 11 and 12. Similarly, second micro-wires 23closer to connection micro-wire 14 have a width W5 that is greater thanwidth W2 of second micro-wires 20 that are farther from connectionmicro-wire 14 than are second micro-wires 23. First micro-wire 10 havingwidth W1 is spaced apart from first micro-wire 10 having width W4 by adistance L4 that is greater than a distance L1 that spaces apart firstmicro-wire 10 having width W3 from first micro-wire 10 having width W4.

In another embodiment, FIGS. 9A and 9B illustrate connection micro-wire14 wider than third micro-wires 30 or first micro-wire 11. Firstmicro-wire 11, closer to connection micro-wire 14 than first micro-wire10, is wider than first micro-wire 10. Likewise, second micro-wire 21,closer to connection micro-wire 14 than second micro-wire 20, is widerthan second micro-wire 20. Furthermore, first micro-wire 11, closer toconnection micro-wire 14 than first micro-wire 10, is more closelyspaced apart from connection micro-wire 14 than first micro-wire 10 isspaced apart from first micro-wire 11. As shown in FIG. 9A, connectionlocations 34 are formed at the intersection of two micro-wires 30 andconnection micro-wire 14. In this embodiment, the adjacent connectionlocations 34 are separated by a distance greater than the distanceseparating vertically adjacent second micro-wires 20. As shown in FIG.9B, connection locations 34 are formed where single micro-wires 30intersect with connection micro-wire 14. In this embodiment, alternatingpairs of adjacent connection locations 34 are separated by a distancegreater than the distance separating vertically adjacent secondmicro-wires 20.

Variably spaced first micro-wires 10 or first or second micro-wires 10,20 having different widths improve the conductance of electricallyconductive micro-wire structure 5 in the direction of preferredconductance when the number, size, or pattern of first or secondmicro-wires 10, 20 is constrained in a given substrate area. Improvedelectrical conduction is also provided by providing the wider first orsecond micro-wires 10, 20 or reduced first micro-wire 10 spacing closerto connection micro-wire 14 connected along its length to thirdmicro-wires 30 along the direction of preferred conductance.Mathematical models demonstrate that electrical conductance is improvedin the direction of preferred conduction, depending on the relativewidths and spacing of first and second micro-wires 10, 20, for exampleby 4, 6, or 8 percent.

In one embodiment of the present invention, one or more of secondmicro-wires 20 is electrically connected to only two adjacent firstmicro-wires 10, intersecting first micro-wires 10 at substantially 90degrees, as illustrated in FIGS. 1-4. Referring to FIG. 5, in anotherembodiment, second micro-wires 20 are electrically connected to multiplefirst micro-wires 10. In this case, first and second micro-wires 10, 20form a rectangular grid for which second micro-wires 20 intersect firstmicro-wires at substantially 90-degree angles. Alternatively, as shownin FIG. 6, angled second micro-wires 25 intersect first micro-wires 10at angles other than 90 degrees. Commonly assigned U.S. patentapplication Ser. No. 13/571,704 hereby incorporated by reference in itsentirety, discloses a variety of micro-wire patterns 55 includingangled, straight, intersecting, and non-intersecting micro-wires 50 thatcan be used in the present invention.

In other embodiments of the present invention and as shown in FIGS. 1-6,one or more of first, second, or third micro-wires 10, 20, 30 havesubstantially straight line segments. Furthermore, at least some firstmicro-wires 10 are substantially parallel or at least some secondmicro-wires 20 are substantially parallel. Alternatively, one or more offirst or second micro-wires 10, 20 is curved. Referring to FIG. 7,curved first micro-wires 16 extending substantially in direction D1intersect curved second micro-wires 26 extending substantially indirection D2 at an angle.

As is illustrated in the embodiment of FIG. 1, first and secondmicro-wires 10, 20 form an array of rectangles arranged in rows orcolumns, wherein adjacent rows or columns of rectangles are offsetforming offset rectangles, for example as seen in a brick wall.Alternatively, as shown in FIG. 5, first and second micro-wires 10, 20form a two-dimensional grid and an array of aligned rectangles havingaligned horizontal edges in a common row and aligned vertical edges in acommon column.

In a useful embodiment (e.g. as illustrated in FIG. 1), micro-wirepattern 55 forms rectangles having long sides at least four times longerthan short sides so that the rectangles have an aspect ratio greaterthan or equal to four. In another embodiment, the spacing (distance L1)between at least two adjacent first micro-wires 10 is less than or equalto four times width W1 of at least one of first micro-wires 10. Anelectrically conductive micro-wire structure 5 having such an aspectratio, a greater aspect ratio, or micro-wire pattern 55 with such awidth to spacing ratio or greater is demonstrated to be manufacturableand to provide improved conductivity. Such micro-wire patterns 55 andelectrically conductive micro-wire structures 5 have a transparency of75% or less. In another embodiment, electrically conductive micro-wirestructures 5 have a transparency of 70% or less. In yet anotherembodiment, electrically conductive micro-wire structures 5 have atransparency of 65% or less. In a further embodiment, electricallyconductive micro-wire structures 5 have a transparency of 50% or less.In other embodiments, electrically conductive micro-wire structures 5have a transparency of 40% or less. To at least some extent, thetransparency of electrically conductive micro-wire structures 5 isdictated by the limitations of the manufacturing process employed. Ingeneral, according to embodiments of the present invention, it is usefulto have an electrically conductive micro-wire structure 5 with a lowertransparency rather than a higher transparency and a higher micro-wire50 density rather than a lower micro-wire 50 density.

Furthermore, since it is useful to form electrically conductivemicro-wire structures 5 in a common step and with common materials withtransparent micro-wire electrodes, it is useful to form micro-wires 50that have a reduced width but an increased thickness 62, for examplehaving a thickness 62 greater than a width, to provide increasedconductivity and reduced width, thereby enhancing conductivity andtransparency. As illustrated in FIG. 16, a micro-channel 60 formed insubstrate 40 has a depth (thickness 62) from substrate surface 41greater than a width W6. As illustrated in FIG. 17, a micro-wire 50located or formed in micro-channel 60 of substrate 40 has acorresponding thickness 62 greater than a width W6. Such micro-wires,when made by a suitable method, can have a conductivity of less than orequal to 4 ohms per square, less than or equal to 3 ohms per square,less than or equal to 2 ohms per square, or less than or equal to 1 ohmper square.

In other embodiments, one or more of first or second micro-wires 10, 20has a width of greater than or equal to 0.5 μm and less than or equal to20 μm to provide an apparently transparent micro-wire electrode (e.g.third micro-wires 30) whose micro-structure can also be used for firstand second micro-wires 10, 20.

The cross section of micro-wire 50 can substantially form a rectangle,as shown in FIG. 17. Alternatively, referring to FIGS. 18 and 19, thecross section of micro-wire 50 can substantially form a trapezoid, whosebase is closer to surface 41 of substrate 40 than the side of thetrapezoid opposite the base (the trapezoid top). Referring to FIG. 18,trapezoidal micro-channel 61 formed in substrate 40 has a cross sectionwith a trapezoid base having a width W8 and a side of the trapezoidopposite the base (the trapezoid top) having a width W7 less than widthW8. As shown in FIG. 19, micro-wire 50 is formed or located in thetrapezoidal micro-channel 61 of FIG. 18. A width of a micro-wire 50formed in a trapezoidal micro-channel 61 can be either width W8 of thetrapezoid base or width W7 of the trapezoid top or some combination,such as the average width. In another embodiment, the bottom ofmicro-channel 60 is curved, for example deeper in the center than at theedges.

According to various embodiments of the present invention and asillustrated in FIGS. 17 and 19, substrate 40 has a surface 41 belowwhich a micro-wire 50 is located or formed in a micro-channel 60.Alternatively, referring to FIG. 20, one or more micro-wires 51 arelocated substantially on surface 41 of substrate 40.

A variety of methods can be used to make micro-wires 50 of electricallyconductive micro-wire structure 5. Some of these methods are known inthe prior art, for example as taught in CN102063951 and U.S. patentapplication Ser. No. 13/571,704 which are hereby incorporated byreference in their entirety. As discussed in CN102063951, a pattern ofmicro-channels 60 can be formed in a substrate using an embossingtechnique. Embossing methods are generally known in the prior art andtypically include coating a curable liquid, such as a polymer, onto arigid substrate. The polymer is partially cured (e.g. through heat orexposure to light or ultraviolet radiation) and then a pattern ofmicro-channels is embossed (impressed) onto the partially cured polymerlayer by a master having a reverse pattern of ridges formed on itssurface. The polymer is then completely cured. FIG. 21A illustrates asubstrate 40 useful for the present invention having a pattern of5μ-wide micro-channels 60 embossed therein. A conductive ink is thencoated over substrate 40 and into micro-channels 60, the excessconductive ink between micro-channels 60 is removed, for example bymechanical buffing, patterned chemical electrolysis, or patternedchemical corrosion. The conductive ink in the micro-channels 60 iscured, for example by heating.

In an alternative method described in CN102063951, a photosensitivelayer, chemical plating, or sputtering is used to pattern conductors,for example using patterned radiation exposure or physical masks.Unwanted material (e.g. photosensitive resist) is removed, followed byelectro-deposition of metallic ions in a bath.

Other methods can be employed. Inkjet deposition of conductive inks isknown in the art, as is printing conductive inks, for example usinggravure offset printing, flexographic printing, pattern-wise exposing aphoto-sensitive silver emulsion, or pattern-wise laser sintering asubstrate 40 coated with conductive ink. In an embodiment, aflexographic printing plate is formed using photolithographic techniquesknown in the art. Conductive ink is applied to the printing plate andthen pattern-wise transferred to substrate 40. After patterneddeposition, the conductive ink is cured.

Conductive inks including metallic particles are known in the art. Inuseful embodiments, the conductive inks include nano-particles, forexample silver, in a carrier fluid such as an aqueous solution. Thecarrier fluid can include surfactants that reduce flocculation of themetal particles. Once deposited, the conductive inks are cured, forexample by heating. The curing process drives out the solution andsinters the metal particles to form a metallic electrical conductor. Inother embodiments, the conductive inks are powders that are pattern-wisetransferred to a substrate and cured or are powders coated on asubstrate and pattern-wise cured. Conductive inks are known in the artand are commercially available.

In any of these cases, conductive inks or other conducting materials areconductive after they are cured and any needed processing completed.Deposited materials are not necessarily electrically conductive beforepatterning or before curing. As used herein, a conductive ink is amaterial that is electrically conductive after any final processing iscompleted and the conductive ink is not necessarily conductive at anyother point in micro-wire 50 formation process.

FIG. 21B is a top view of an electrically conductive micro-wirestructure 5 of the present invention formed using an emboss-and-fillmethod and having a substrate 40 with first micro-wires 10 extending ina first direction D1 across substrate 40 and second micro-wires 20extending in a second direction D2 different from the first direction D1across substrate 40. Each second micro-wire 20 is electrically connectedto two first micro-wires 10. Third micro-wires 30 are electricallyconnected to a connection micro-wire 14 at connection locations 34.

As described above with respect to FIG. 16, in emboss-and fill methodsof the present invention a pattern of micro-channels 60 is created on asubstrate 40 with each micro-channel 60 having a thickness 62. Aconductive ink is then coated over substrate 40 and into micro-channels60. The excess conductive ink between micro-channels 60 is removed, forexample by using a squeegee. The conductive inks include nano-particles,for example silver, in a carrier fluid such as an aqueous solution.Typical weight concentrations of the silver nano-particles range from30% to 90%. Because of its high density, the volume concentration ofsilver in the solution is much lower, typically 4-50%. After fillingmicro-channels 60 with this conductive ink solution, the carrier fluidevaporates as illustrated in FIG. 27A, resulting in a silver micro-wire50 in micro-channel 60 with a width W6 and a silver thickness 63 lessthan the thickness 62 of embossed micro-channel 50. The actual finalsilver thickness 63 of silver micro-wire 50 depends on the fillingmethod and silver concentration in the conductive ink solution.

It has been demonstrated experimentally that the amount of silverremaining after drying is dependent on width W6 of micro-channel 60 insubstrate 40. For micro-channel 60 widths W6 of 2-20 um, the remainingsilver fills micro-channel 60 as depicted in FIG. 27A. As width W6 ofmicro-channel 60 increases, silver thickness 63 of the remaining silverin micro-wire 50 at the middle of micro-channel 60 decreases. As aresult, the sheet resistance of silver micro-wire 50 increases as widthW6 of micro-channel 60 increases. Above a width W6 of approximately 20um, the silver micro-wire 50 cross section begins to look as illustratedin FIG. 27B. There is little or no silver in the center of micro-channel60 in substrate 40 but with some silver at the sidewalls of themicro-channel 60. This effect substantially increases the resistance ofthe line and makes it more susceptible to defects.

Referring to FIG. 22, in a method useful for making electricallyconductive micro-wire structures 5 of the present invention, a substrate40 is provided 200 and an imprint master is provided 205. Substrate 40is coated 210, for example with a polymer and partially cured. Thepartially cured polymer coating is imprinted 215 with the print masterand cured 220. Substrate 40 is coated 225 with a conductive ink, cleanedin step 230, and the remaining ink is cured.

Referring to an alternative method illustrated in FIG. 23, a substrate40 is provided 200 and a print master (e.g. a flexographic printingplate) is provided 250. The print master is inked 255 with conductiveink and the ink is pattern-wise printed 260 on substrate 40. Theconductive ink is cured 265.

Referring to another alternative method illustrated in FIG. 24, asubstrate 40 is provided 200 and coated 275 with a photosensitiveconductor, for example a silver halide emulsion or a metal layer coveredwith a photo resist. The substrate 40 is exposed 280 to patternedradiation, for example with a laser or with electromagnetic radiationthrough a mask. The patterned photosensitive conductor is then cured ifnecessary, e.g. by fixing, and unwanted photosensitive conductormaterial removed 285 by etching or washing.

In yet another alternative method illustrated in FIG. 25, a substrate 40is provided 200 and a conductive ink provided 300. The conductive ink ispattern-wise deposited 305 on substrate 40, for example using an inkjetapparatus, and the conductive ink is cured 310. Electrically conductivemicro-wire structure 5 of the present invention can be employed inelectronic devices to conduct electricity across a substrate 40. Forexample, referring to FIG. 26, electrically conductive micro-wirestructure 5 can be electrically connected to a transparent micro-wireelectrode 46 (e.g. formed from third micro-wires 30 in FIGS. 8 and 9)formed on substrate 40 through an electrical connector 44 and wires 134to touch-screen controller 140 in a touch-screen device. Signals fromtouch-screen controller 140 pass through conventional wires 134 inelectrical contact with electrical connector 44 to electricallyconductive micro-wire structure 5. Electrically conductive micro-wirestructure 5 conducts electrical signals to and from transparentmicro-wire electrodes 46 to operate the touch-screen device. Electricitypreferentially passes in the preferred direction of the length of firstmicro-wires 10 in electrically conductive micro-wire structure 5 andpreferentially passes through connection micro-wire 14 and the widerfirst and second micro-wires 10, 20. In the event of manufacturingdefects in first micro-wires 10, second micro-wires 20 providealternative conduction paths for electricity, thereby providingrobustness to electrically conductive micro-wire structure 5.

Substrate 40 of the present invention can include any material capableof providing a supporting surface on which micro-wires 50 can be formedand patterned. Substrates such as glass, metal, or plastic can be usedand are known in the art together with methods for providing suitablesurfaces. In a useful embodiment, substrate 40 is substantiallytransparent, for example having a transparency of greater than 90%, 80%70% or 50% in the visible range of electromagnetic radiation.

Micro-wires 50 can be metal, for example silver, gold, aluminum, nickel,tungsten, titanium, tin, or copper or various metal alloys including,for example silver, gold, aluminum, nickel, tungsten, titanium, tin, orcopper. Micro-wires 50 can be a thin metal layer composed of highlyconductive metals such as gold, silver, copper, or aluminum. Otherconductive metals or materials can be used. Alternatively, micro-wires50 can include cured or sintered metal particles such as nickel,tungsten, silver, gold, titanium, or tin or alloys such as nickel,tungsten, silver, gold, titanium, or tin. Conductive inks can be used toform micro-wires 50 with pattern-wise deposition or pattern-wiseformation followed by curing steps. Other materials or methods forforming micro-wires 50 can be employed and are included in the presentinvention.

Micro-wires 50 can be, but need not be, opaque. Micro-wires 50 can beformed by patterned deposition of conductive materials or of patternedprecursor materials that are subsequently processed, if necessary, toform a conductive material. Suitable methods and materials are known inthe art, for example inkjet deposition or screen printing withconductive inks. Alternatively, micro-wires 50 can be formed byproviding a blanket deposition of a conductive or precursor material andpatterning and curing, if necessary, the deposited material to form amicro-wire pattern 55 of micro-wires 50. Photo-lithographic andphotographic methods are known to perform such processing. The presentinvention is not limited by the micro-wire materials or by methods offorming a micro-wire pattern 55 of micro-wires 50 on a supportingsubstrate surface. Commonly-assigned U.S. patent application Ser. No.13/406,649 discloses a variety of materials and methods for formingpatterned micro-wires on a substrate surface.

In various embodiments, micro-wires 50 in electrically conductivemicro-wire structure 5 are formed in a micro-wire layer that forms aconductive mesh of electrically connected micro-wires 50. If substrate40 on or in which micro-wires 50 are formed is planar, for example, arigid planar substrate such as a glass substrate, micro-wires 50 in amicro-wire layer are formed in, or on, a common plane as a conductive,electrically connected mesh forming electrically conductive micro-wirestructure 5. If substrate 40 is flexible and curved, for example aplastic substrate, micro-wires 50 in a micro-wire layer are aconductive, electrically connected mesh that is a common distance from asurface 41 of flexible substrate 40.

Micro-wires 50 can be formed directly on substrate 40 or over substrate40 on layers formed on substrate 40. The words “on”, “over’, or thephrase “on or over” indicate that micro-wires 50 of the electricallyconductive micro-wire structure 5 of the present invention can be formeddirectly on a surface 41 of substrate 40, on layers formed on substrate40, or on either or both of opposing sides of substrate 40. Thus,micro-wires 50 of the electrically conductive micro-wire structure 5 ofthe present invention can be formed under or beneath substrate 40.“Over” or “under”, as used in the present disclosure, are simplyrelative terms for layers located on or adjacent to opposing surfaces ofa substrate 40. By flipping substrate 40 and related structures over,layers that are over substrate 40 become under substrate 40 and layersthat are under substrate 40 become over substrate 40.

Micro-wires 50 of electrically conductive micro-wire structure 5 of thepresent invention can form an electrode that conducts electricity betterin one direction (in this case, first direction D1, FIG. 1) than inanother conductive direction, for example across the width ofelectrically conductive micro-wire structure 5 (D2) or than in anotherconductive direction that is not the length direction of firstmicro-wires 10. Electrically conductive micro-wire structure 5 conductselectricity better in the length direction of first micro-wires 10because the conductive path is shorter per linear dimension in thelength direction of first micro-wires 10 and, in some embodiments,because micro-wires 50 are wider in a dimension orthogonal to the lengthdirection, for example as measured in ohms per centimeter.

The length direction of electrically conductive micro-wire structure 5(e.g. first direction D1) is typically the direction of the greatestspatial extent of electrically conductive micro-wire structure 5 oversubstrate 40 on which electrically conductive micro-wire structure 5 isformed. Electrically conductive micro-wire structures 5 formed on orover substrates 40 are typically rectangular in shape, or formed ofrectangular elements, with a length and a width, and the length is muchgreater than the width. In any case, the length direction can beselected to be a direction of desired greatest conductance ofelectrically conductive micro-wire structure 5. Electrically conductivemicro-wire structure 5 are generally used to conduct electricity from afirst point on substrate 40 to a second point on substrate 40 and thedirection of electrically conductive micro-wire structure 5 from thefirst point to the second point can be the length direction.

A variety of micro-wire patterns 55 can be used according to variousembodiments of the present invention. Micro-wires 50 can be formed atthe same or different angles to each other, can cross over or intersecteach other, can be parallel, can have different lengths, or can havereplicated portions or patterns. Some or all of micro-wires 50 can becurved or straight and can form line segments in a variety of patterns.Micro-wires 50 can be formed on opposing sides of the same substrate 40or on facing sides of separate substrates 40 or some combination ofthose arrangements. Such embodiments are included in the presentinvention.

In an example and non-limiting embodiment of the present invention, eachmicro-wire 50 is from 5 microns wide to one micron wide and is separatedfrom neighboring micro-wires 50 by a distance of 20 microns or less, forexample 10 microns, 5 microns, 2 microns, or one micron.

Methods and device for forming and providing substrates, coatingsubstrates, patterning coated substrates, or pattern-wise depositingmaterials on a substrate are known in the photo-lithographic arts.Likewise, tools for laying out electrodes, conductive traces, andconnectors are known in the electronics industry as are methods formanufacturing such electronic system elements. Hardware controllers forcontrolling touch screens and displays and software for managing displayand touch screen systems are well known. These tools and methods can beusefully employed to design, implement, construct, and operate thepresent invention. Methods, tools, and devices for operating capacitivetouch screens can be used with the present invention.

The present invention is useful in a wide variety of electronic devices.Such devices can include, for example, photovoltaic devices, OLEDdisplays and lighting, LCD displays, plasma displays, inorganic LEDdisplays and lighting, electrophoretic displays, electrowettingdisplays, dimming mirrors, smart windows, transparent radio antennae,transparent heaters and other touch screen devices such as resistivetouch screen devices.

The invention has been described in detail with particular reference tocertain embodiments thereof, but it will be understood that variationsand modifications can be effected within the spirit and scope of theinvention.

PARTS LIST

-   -   D1 first direction    -   D2 second direction    -   W1 width    -   W2 width    -   W3 width    -   W4 width    -   W5 width    -   W6 width    -   W7 width    -   W8 width    -   L1 distance    -   L2 distance    -   L3 distance    -   L4 distance    -   L5 distance    -   5 electrically conductive micro-wire structure    -   10 first micro-wire    -   11 first micro-wire    -   12 first micro-wire    -   14 connection micro-wire    -   16 curved first micro-wire    -   20 second micro-wire    -   21 second micro-wire    -   22 second micro-wire    -   23 second micro-wire    -   24 second micro-wire    -   25 angled second micro-wire    -   26 curved second micro-wire    -   30 third micro-wire    -   34 connection location    -   40 substrate    -   41 substrate surface    -   44 electrical connector    -   46 transparent micro-wire electrode    -   50 micro-wire    -   51 micro-wire    -   55 micro-wire pattern    -   60 micro-channel    -   61 trapezoidal micro-channel    -   62 thickness    -   63 silver thickness    -   100 touch screen and display system    -   110 display    -   111 display area    -   120 touch screen    -   122 first transparent substrate    -   124 transparent dielectric layer    -   126 second transparent substrate    -   128 first pad area    -   129 second pad area    -   130 first transparent electrode    -   132 second transparent electrode    -   134 wires    -   136 electrical buss    -   140 touch-screen controller    -   142 display controller    -   150 micro-wire    -   156 micro-pattern    -   200 provide substrate step    -   205 provide imprint master step    -   210 coat substrate step    -   215 imprint substrate with master step    -   220 cure coated substrate step    -   225 coat substrate and fill channels with ink step    -   230 clean substrate step    -   235 cure ink step    -   250 provide print master step    -   255 ink print master step    -   260 print substrate with ink step    -   265 cure ink step    -   275 coat substrate with photosensitive conductor step    -   280 image & cure pattern step    -   285 etch and wash patterned conductor step    -   300 provide conductive ink step    -   305 pattern-wise deposit ink step    -   310 cure ink step

1. Micro-wires arranged to form an electrical conductor connected to anelectrode structure, comprising: a) the electrical conductor having: i)a plurality of spaced-apart first micro-wires extending in a firstdirection, wherein one of the first micro-wires is a connectionmicro-wire; and ii) a plurality of spaced-apart second micro-wiresextending in a second direction different from the first direction, atleast two adjacent second micro-wires spaced apart by a distance greaterthan the spacing between at least two adjacent first micro-wires andeach second micro-wire being electrically connected to at least twofirst micro-wires; and b) the electrode structure having a plurality ofelectrically connected third micro-wires electrically connected to theconnection micro-wire at spaced-apart connection locations and at leastsome of the adjacent connection locations are separated by a distancegreater than any of the distances separating the second micro-wires. 2.The micro-wires of claim 1, wherein any two adjacent second micro-wiresare spaced apart by a distance greater than the spacing between at leasttwo adjacent first micro-wires.
 3. The micro-wires of claim 1, whereinany two adjacent second micro-wires are spaced apart by a distancegreater than the spacing between any two adjacent first micro-wires. 4.The micro-wires of claim 1, wherein at least one of the firstmicro-wires is wider than at least one of the second micro-wires, orwherein at least one of the first micro-wires is wider than any of thesecond micro-wires, or wherein any of the first micro-wires is widerthan any of the second micro-wires.
 5. The micro-wires of claim 1,wherein the connection micro-wire is wider than at least one of theother first micro-wires or wherein the connection micro-wire is widerthan any of the other first micro-wires.
 6. The micro-wires of claim 4,wherein at least one of the first micro-wires that is closer to theconnection micro-wire is wider than another first micro-wire that isfarther from the connection micro-wire.
 7. The micro-wires of claim 1,wherein at least one of the second micro-wires that is closer to theconnection micro-wire is wider than another second micro-wire that isfarther from the connection micro-wire.
 8. The micro-wires of claim 1,wherein at least one of the first micro-wires is wider than the thirdmicro-wires.
 9. The micro-wires of claim 1, wherein the first directionis a direction of preferred conductivity.
 10. The micro-wires of claim1, wherein adjacent first micro-wires are substantially equally spacedapart or wherein adjacent second micro-wires are substantially equallyspaced apart.
 11. The micro-wires of claim 1, wherein at least twoadjacent first micro-wires closer to the connection micro-wire are moreclosely spaced than at least two adjacent first micro-wires that arefarther from the connection micro-wire.
 12. The micro-wires of claim 1,wherein one or more of the second micro-wires is electrically connectedto only two adjacent first micro-wires.
 13. The micro-wires of claim 1,wherein one or more of the second micro-wires intersects two firstmicro-wires at substantially 90-degree angles.
 14. The micro-wires ofclaim 1, wherein one or more of the second micro-wires intersect one ormore of the first micro-wires at a different angle than one or more ofthe third micro-wires intersect the connection micro-wire.
 15. Themicro-wires of claim 1, wherein one or more of the first, second, orthird micro-wires have substantially straight line segments.
 16. Themicro-wires of claim 1, wherein at least some first micro-wires aresubstantially parallel or wherein at least some second micro-wires aresubstantially parallel.
 17. The micro-wires of claim 1, wherein one ormore of the first or second micro-wires is curved.
 18. The micro-wiresof claim 1, wherein the first and second micro-wires form an array ofrectangles.
 19. The micro-wires of claim 18, wherein the rectangles havean aspect ratio greater than four.
 20. The micro-wires of claim 18,wherein the array of rectangles forms a two-dimensional grid or an arrayof offset rectangles.
 21. The micro-wires of claim 1, wherein thespacing between at least two adjacent first micro-wires is less thanfour times the width of at least one of the first micro-wires.
 22. Themicro-wires of claim 1, wherein the pattern has a transparency of 80% orless.
 23. The micro-wires of claim 1, wherein one or more of the firstor second micro-wires has a width of greater than or equal to 0.5 um andless than or equal to 20 um.
 24. The micro-wires of claim 1, wherein thepattern of micro-wires formed by the plurality of first and secondmicro-wires has an electrical resistance that is less than the patternof micro-wires formed by the plurality of third micro-wires.